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? 2004 microchip technology inc. ds21422c-page 1 tc4426/tc4427/tc4428 features ? high peak output current ? 1.5a wide input supply voltage operating range: - 4.5v to 18v high capacitive load drive capability ? 1000 pf in 25 ns (typ.) short delay times ? 40 ns (typ.) matched rise and fall times low supply current: - with logic ? 1 ? input ? 4 ma - with logic ? 0 ? input ? 400 a low output impedance ? 7 ? latch-up protected: will withstand 0.5a reverse current input will withstand negative inputs up to 5v esd protected ? 4 kv pin-compatible with the tc426/tc427/tc428 space-saving 8-pin msop and 8-pin 6x5 dfn packages applications switch mode power supplies line drivers pulse transformer drive general description the tc4426/tc4427/tc4428 are improved versions of the earlier tc426/tc427/tc428 family of mosfet drivers. the tc4426/tc4427/tc4428 devices have matched rise and fall times when charging and discharging the gate of a mosfet. these devices are highly latch-up resistant under any conditions within their power and voltage ratings. they are not subject to damage when up to 5v of noise spik- ing (of either polarity) occurs on the ground pin. they can accept, without damage or logic upset, up to 500 ma of reverse current (of either polarity) being forced back into their outputs. all terminals are fully protected against electrostatic discharge (esd) up to 4kv. the tc4426/tc4427/tc4428 mosfet drivers can easily charge/discharge 1000 pf gate capacitances in under 30 ns. these device provide low enough impedances in both the on and off states to ensure the mosfet's intended state will not be affected, even by large transients. other compatible drivers are the tc4426a/tc4427a/ tc4428a family of devices. the tc4426a/tc4427a/ tc4428a devices have matched leading and falling edge input-to-output delay times, in addition to the matched rise and fall times of the tc4426/tc4427/ tc4428 devices. package types note 1: exposed pad of the dfn package is electrically isolated. 8-pin dfn (1) nc in a gnd in b 2 3 4 5 6 7 8 1 1 2 3 4 nc 5 6 7 8 out a out b nc in a gnd in b v dd tc4426 tc4427 tc4426 tc4427 nc out a out b v dd tc4426 tc4427 tc4428 nc out a out b v dd tc4428 tc4428 nc out a out b v dd tc4426 tc4427 nc out a out b v dd tc4428 nc out a out b v dd 8-pin msop/ pdip/soic 1.5a dual high-speed power mosfet drivers
tc4426/tc4427/tc4428 ds21422c-page 2 ? 2004 microchip technology inc. functional block diagram effective input c = 12 pf (each input) tc4426/tc4427/tc4428 output input gnd v dd 300 mv 4.7v inverting non-inverting note 1: tc4426 has two inverting drivers, while the tc4427 has two non-inverting drivers. the tc4428 has one inverting and one non-inverting driver. 2: ground any unused driver input. 1.5 ma
? 2004 microchip technology inc. ds21422c-page 3 tc4426/tc4427/tc4428 1.0 electrical characteristics absolute maximum ratings ? supply voltage ..................................................... +22v input voltage, in a or in b ..................................... (v dd + 0.3v) to (gnd ? 5v) package power dissipation (t a 70c) dfn .............................................................. note 3 msop .......................................................... 340 mw pdip ............................................................ 730 mw soic............................................................ 470 mw storage temperature range.............. -65c to +150c maximum junction temperature ...................... +150c ? stresses above those listed under "absolute maximum ratings" may cause permanent damage to the device. these are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the spec ifications is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. pin function table dc characteristics name function nc no connection in a input a gnd ground in b input b out b output b v dd supply input out a output a nc no connection electrical specifications: unless otherwise noted, t a = +25oc with 4.5v v dd 18v. parameters sym min typ max units conditions input logic ? 1 ?, high input voltage v ih 2.4 ? ? v note 2 logic ? 0 ?, low input voltage v il ??0.8v input current i in -1.0 ? +1.0 a 0v v in v dd output high output voltage v oh v dd ? 0.025 ? ? v dc test low output voltage v ol ? ? 0.025 v dc test output resistance r o ?710 ? i out = 10 ma, v dd = 18v peak output current i pk ?1.5?av dd = 18v latch-up protection withstand reverse current i rev ? > 0.5 ? a duty cycle 2%, t 300 s v dd = 18v switching time (note 1) rise time t r ?1930ns figure 4-1 fall time t f ?1930ns figure 4-1 delay time t d1 ?2030ns figure 4-1 delay time t d2 ?4050ns figure 4-1 power supply power supply current i s ? ? ? ? 4.5 0.4 ma v in = 3v (both inputs) v in = 0v (both inputs) note 1: switching times ensured by design. 2: for v temperature range devices, the v ih (min) limit is 2.0v. 3: package power dissipation is dependent on the copper pad area on the pcb.
tc4426/tc4427/tc4428 ds21422c-page 4 ? 2004 microchip technology inc. dc characteristics (over ope rating temperature range) temperature characteristics electrical specifications: unless otherwise noted, over operating temperature range with 4.5v v dd 18v. parameters sym min typ max units conditions input logic ? 1 ?, high input voltage v ih 2.4 ? ? v note 2 logic ? 0 ?, low input voltage v il ??0.8v input current i in -10 ? +10 a 0v v in v dd output high output voltage v oh v dd ? 0.025 ? ? v dc test low output voltage v ol ??0.025vdc test output resistance r o ?912 ? i out = 10 ma, v dd = 18v peak output current i pk ?1.5?av dd = 18v latch-up protection withstand reverse current i rev ? >0.5 ? a duty cycle 2%, t 300 s v dd = 18v switching time (note 1) rise time t r ??40ns figure 4-1 fall time t f ??40ns figure 4-1 delay time t d1 ??40ns figure 4-1 delay time t d2 ??60ns figure 4-1 power supply power supply current i s ? ? ? ? 8.0 0.6 ma v in = 3v (both inputs) v in = 0v (both inputs) note 1: switching times ensured by design. 2: for v temperature range devices, the v ih (min) limit is 2.0v. electrical specifications: unless otherwise noted, all parameters apply with 4.5v v dd 18v. parameters sym min typ max units conditions temperature ranges specified temperature range (c) t a 0?+70c specified temperature range (e) t a -40 ? +85 c specified temperature range (v) t a -40 ? +125 c maximum junction temperature t j ? ? +150 c storage temperature range t a -65 ? +150 c package thermal resistances thermal resistance, 8l-6x5 dfn ja ?33.2?c/w thermal resistance, 8l-msop ja ?206?c/w thermal resistance, 8l-pdip ja ?125?c/w thermal resistance, 8l-soic ja ?155?c/w
? 2004 microchip technology inc. ds21422c-page 5 tc4426/tc4427/tc4428 2.0 typical performance curves note: unless otherwise indicated, t a = +25oc with 4.5v v dd 18v. figure 2-1: rise time vs. supply voltage. figure 2-2: rise time vs. capacitive load. figure 2-3: rise and fall times vs. temperature. figure 2-4: fall time vs. supply voltage. figure 2-5: fall time vs. capacitive load. figure 2-6: propagation delay time vs. supply voltage. note: the graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. the performance characteristics listed herein are not tested or guaranteed. in some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. t rise (nsec) 4681012 14 16 18 100 pf 470 pf 2200 pf 1500 pf 100 1000 pf 80 60 40 20 0 v dd (v) 100 1000 10,000 c (pf) load 5v 10v 15v 100 80 60 40 20 0 t rise (nsec) time (nsec) t rise tem p erature ( ?c ) c = 1000 pf load v = 17.5v dd 60 ?5 ?5 5 25 45 65 85 105 125 ?5 t fall 50 40 30 20 10 t fall (nsec) 4681012 14 16 18 100 pf 470 pf 1000 pf 2200 pf 1500 pf 100 80 60 40 20 0 v dd (v) 100 1000 10,000 5v 10v c (pf) load 100 80 60 40 20 0 t fall (nsec) 15v 20 25 30 35 40 45 50 55 60 65 70 75 80 4 6 8 10 12 14 16 18 v dd (v) propagation delay (nsec) t d1 t d2 c load = 1000 pf v in = 5v
tc4426/tc4427/tc4428 ds21422c-page 6 ? 2004 microchip technology inc. note: unless otherwise indicated, t a = +25oc with 4.5v v dd 18v. figure 2-7: propagation delay time vs. input amplitude. figure 2-8: supply current vs. supply voltage. figure 2-9: output resistance (r oh ) vs. supply voltage. figure 2-10: propagation delay time vs. temperature. figure 2-11: supply current vs. temperature. figure 2-12: output resistance (r ol ) vs. supply voltage. 10 15 20 25 30 35 40 45 50 55 60 0123456789101112 input amplitude (v) propagation delay (nsec) t d1 t d2 c load = 1000 pf v dd = 12v 4 i (ma) quiescent 18 6 8 10 12 14 16 0.1 both inputs = 1 both inputs = 0 v dd 1 4681012 14 16 18 v dd r ds(on) ( ? ) 20 25 15 10 5 worst case @ t j = +150?c typical @ t a = +25?c 10 15 20 25 30 35 40 45 -55 -35 -15 5 25 45 65 85 105 125 temperature (oc) delay time (nsec) t d1 t d2 c load = 1000 pf v in = 5v v dd = 18v t a (?c) i quiescent (ma) 4.0 3.5 3.0 2.5 2.0 ?5 ?5 ?5 5 25 45 65 85 105 125 v = 18v dd both inputs = 1 4681012 14 16 1 8 20 v dd 25 15 10 5 worst case @ t j = +150?c typical @ t a = +25?c r ds(on) ( ? )
? 2004 microchip technology inc. ds21422c-page 7 tc4426/tc4427/tc4428 note: unless otherwise indicated, t a = +25oc with 4.5v v dd 18v. figure 2-13: supply current vs. capacitive load. figure 2-14: supply current vs. capacitive load. figure 2-15: supply current vs. capacitive load. figure 2-16: supply current vs. frequency. figure 2-17: supply current vs. frequency. figure 2-18: supply current vs. frequency. 60 100 1000 10,000 i supply (ma) 2 mhz 600 khz 200 khz 20 khz 900 khz c (pf) load v = 18v dd 50 40 30 20 10 0 100 1000 10,000 2 mhz 600 khz 200 khz 20 khz 900 khz v = 12v dd c (pf) load 60 50 40 30 20 10 0 i supply (ma) 100 1000 10,000 2 mhz 200 khz 20 khz 600 khz 900 khz v = 6v dd c (pf) load 60 50 40 30 20 10 0 i supply (ma) 10 100 1000 frequency ( khz ) 1000 pf 2200 pf v = 18v dd 100 pf 60 50 40 30 20 10 0 i supply (ma) 10 100 1000 frequency (khz) 1000 pf 2200 pf 100 pf v = 12v dd 60 50 40 30 20 10 0 i supply (ma) 10 100 1000 frequency ( khz ) 1000 pf 2200 pf 100 pf v = 6v dd 60 50 40 30 20 10 0 i supply (ma)
tc4426/tc4427/tc4428 ds21422c-page 8 ? 2004 microchip technology inc. note: unless otherwise indicated, t a = +25oc with 4.5v v dd 18v. figure 2-19: crossover energy vs. supply voltage. 4 a ?sec 18 6 8 10 12 14 16 8 7 6 5 4 3 2 10 ? 10 ? 9 v dd note: the values on this graph represent the loss seen by both drivers in a package during one complete cycle. for a single driver, divide the stated values by 2. for a single transition of a single driver, divide the stated value by 4.
? 2004 microchip technology inc. ds21422c-page 9 tc4426/tc4427/tc4428 3.0 pin descriptions the descriptions of the pins are listed in table 3-1. table 3-1: pin function table (1) 3.1 inputs a and b mosfet driver inputs a and b are high-impedance, ttl/cmos compatible inputs. these inputs also have 300 mv of hysteresis between the high and low thresholds that prevents output glitching even when the rise and fall time of the input signal is very slow. 3.2 ground (gnd) ground is the device return pin. the ground pin(s) should have a low-impedance connection to the bias supply source return. high peak currents will flow out the ground pin(s) when the capacitive load is being discharged. 3.3 output a and b mosfet driver outputs a and b are low-impedance, cmos push-pull style outputs. the pull-down and pull- up devices are of equal strength, making the rise and fall times equivalent. 3.4 supply input (v dd ) the v dd input is the bias supply for the mosfet driver and is rated for 4.5v to 18v with respect to the ground pin. the v dd input should be bypassed with local ceramic capacitors. the value of these capacitors should be chosen based on the capacitive load that is being driven. a value of 1.0 f is suggested. 3.5 exposed metal pad the exposed metal pad of the 6x5 dfn package is not internally connected to any potential. therefore, this pad can be connected to a ground plane or other cop- per plane on a printed circuit board, to aid in heat removal from the package. 8-pin pdip/ msop/soic 8-pin dfn symbol description 1 1 nc no connection 2 2 in a input a 33gndground 4 4 in b input b 55out boutput b 66v dd supply input 77out aoutput a 8 8 nc no connection ? pad nc exposed metal pad note 1: duplicate pins must be connected for proper operation.
tc4426/tc4427/tc4428 ds21422c-page 10 ? 2004 microchip technology inc. 4.0 applications information figure 4-1: switching time test circuit. c l = 1000 pf 0.1 f 4.7 f inverting driver non-inverting driver input v dd = 18v input output t d1 t f t r t d2 input: 100 khz, square wave, t rise = t fall 10 ns output input output t d1 t f t r t d2 +5v 10% 90% 10% 90% 10% 90% v dd 0v 90% 10% 10% 10% 90% +5v v dd 0v 0v 0v 90% 3 2 7 6 4 5
? 2004 microchip technology inc. ds21422c-page 11 tc4426/tc4427/tc4428 5.0 packaging information 5.1 package marking information xxxxxxxx xxxxxnnn yyww 8-lead pdip (300 mil) example: tc4427 cpa256 0420 8-lead soic (150 mil) example: xxxxxxxx xxxxyyww nnn tc4428 coa0420 256 8-lead msop example: xxxxx ywwnnn 4426c 420256 legend: xx...x customer specific information* y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ?01?) nnn alphanumeric traceability code note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * standard device marking consists of microchip part number, year code, week code, and traceability code. 8-lead dfn example : xxxxxxx xxxxxxx xxyyww nnn tc4426 emf 0420 256
tc4426/tc4427/tc4428 ds21422c-page 12 ? 2004 microchip technology inc. 8-lead plastic dual flat no lead package (mf) 6x5 mm body (dfn-s) ? saw singulated
? 2004 microchip technology inc. ds21422c-page 13 tc4426/tc4427/tc4428 8-lead plastic micro small outline package (ms) (msop) d a a1 l c (f) a2 e1 e p b n 1 2 dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not .037 ref f footprint (reference) exceed .010" (0.254mm) per side. notes: drawing no. c04-111 *controlling parameter mold draft angle top mold draft angle bottom foot angle lead width lead thickness c b .003 .009 .006 .012 dimension limits overall height molded package thickness molded package width overall length foot length standoff overall width number of pins pitch a l e1 d a1 e a2 .016 .024 .118 bsc .118 bsc .000 .030 .193 typ. .033 min p n units .026 bsc nom 8 inches 0.95 ref - - .009 .016 0.08 0.22 0 0.23 0.40 8 millimeters* 0.65 bsc 0.85 3.00 bsc 3.00 bsc 0.60 4.90 bsc .043 .031 .037 .006 0.40 0.00 0.75 min max nom 1.10 0.80 0.15 0.95 max 8 -- - 15 5 - 15 5 - jedec equivalent: mo-187 0 - 8 5 5 - - 15 15 - - - -
tc4426/tc4427/tc4428 ds21422c-page 14 ? 2004 microchip technology inc. 8-lead plastic dual in-line (p) ? 300 mil (pdip) b1 b a1 a l a2 p e eb c e1 n d 1 2 units inches* millimeters dimension limits min nom max min nom max number of pins n 88 pitch p .100 2.54 top to seating plane a .140 .155 .170 3.56 3.94 4.32 molded package thickness a2 .115 .130 .145 2.92 3.30 3.68 base to seating plane a1 .015 0.38 shoulder to shoulder width e .300 .313 .325 7.62 7.94 8.26 molded package width e1 .240 .250 .260 6.10 6.35 6.60 overall length d .360 .373 .385 9.14 9.46 9.78 tip to seating plane l .125 .130 .135 3.18 3.30 3.43 lead thickness c .008 .012 .015 0.20 0.29 0.38 upper lead width b1 .045 .058 .070 1.14 1.46 1.78 lower lead width b .014 .018 .022 0.36 0.46 0.56 overall row spacing eb .310 .370 .430 7.87 9.40 10.92 mold draft angle top 51015 51015 mold draft angle bottom 51015 51015 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed jedec equivalent: ms-001 drawing no. c04-018 .010? (0.254mm) per side. significant characteristic
? 2004 microchip technology inc. ds21422c-page 15 tc4426/tc4427/tc4428 8-lead plastic small outline (sn) ? narrow, 150 mil (soic) foot angle 048048 15 12 0 15 12 0 mold draft angle bottom 15 12 0 15 12 0 mold draft angle top 0.51 0.42 0.33 .020 .017 .013 b lead width 0.25 0.23 0.20 .010 .009 .008 c lead thickness 0.76 0.62 0.48 .030 .025 .019 l foot length 0.51 0.38 0.25 .020 .015 .010 h chamfer distance 5.00 4.90 4.80 .197 .193 .189 d overall length 3.99 3.91 3.71 .157 .154 .146 e1 molded package width 6.20 6.02 5.79 .244 .237 .228 e overall width 0.25 0.18 0.10 .010 .007 .004 a1 standoff 1.55 1.42 1.32 .061 .056 .052 a2 molded package thickness 1.75 1.55 1.35 .069 .061 .053 a overall height 1.27 .050 p pitch 8 8 n number of pins max nom min max nom min dimension limits millimeters inches* units 2 1 d n p b e e1 h l c 45 a2 a a1 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010? (0.254mm) per side. jedec equivalent: ms-012 drawing no. c04-057 significant characteristic
tc4426/tc4427/tc4428 ds21422c-page 16 ? 2004 microchip technology inc. notes:
? 2004 microchip technology inc. ds21422c-page 17 tc4426/tc4427/tc4428 product identification system to order or obtain information, e. g., on pricing or delivery, refer to the factory or the listed sales office . sales and support device: tc4426: 1.5a dual mosfet driver, inverting tc4427: 1.5a dual mosfet driver, non-inverting tc4428: 1.5a dual mosfet driver, complementary temperature range: c = 0c to +70c (pdip and soic only) e = -40c to +85c v = -40c to +125c package: mf = dual, flat, no-lead (6x5 mm body), 8-lead mf713 = dual, flat, no-lead (6x5 mm body), 8-lead (tape and reel) oa = plastic soic, (150 mil body), 8-lead oa713 = plastic soic, (150 mil body), 8-lead (tape and reel) pa = plastic dip (300 mil body), 8-lead ua = plastic micro small outline (msop), 8-lead ua713 = plastic micro small outline (msop), 8-lead (tape and reel) pb free: g = lead-free device * = blank * available on selected package s. contact your local sales representative for availability. examples: a) tc4426coa: 1.5a dual inverting mosfet driver, 0c to +70c soic package. b) tc4426eua: 1.5a dual inverting mosfet driver, -40c to +85c. msop package. c) tc4426emf: 1.5a dual inverting mosfet driver, -40c to +85c, dfn package. a) tc4427cpa: 1.5a dual non-inverting mosfet driver, 0c to +70c pdip package. b) tc4427epa: 1.5a dual non-inverting mosfet driver, -40c to +85c pdip package. a) tc4428 coa713:1.5a dual complementary mosfet driver, 0c to +70c, soic package, tape and reel. b) tc4428emf: 1.5a dual complementary, mosfet driver, -40c to +85c dfn package. part no. x xx package temperature range device xxx tape & reel x pb free data sheets products supported by a preliminary data sheet may have an errata sheet describing minor operational differences and recommended workarounds. to determine if an errata sheet exists for a particular device, please contact one of the following: 1. your local microchip sales office 2. the microchip corporate literature center u.s. fax: (480) 792-7277 3. the microchip worldwide site (www.microchip.com) please specify which device, revision of silicon and data sheet (include literature #) you are using. customer notification system register on our web site (www.microchip.com/cn) to receive the most current information on our products.
tc4426/tc4427/tc4428 ds21422c-page 18 ? 2004 microchip technology inc. notes:
? 2004 microchip technology inc. ds21422c-page 19 information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. it is your responsibility to ensure that your application m eets with your specifications. no representation or warranty is given and no liability is assumed by microchip technol ogy incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. use of micr ochip?s products as critical components in life support syst ems is not authorized except with express written approval by microchip. no licenses are conveyed, implicitly or ot herwise, under any intellectual property rights. trademarks the microchip name and logo, the microchip logo, accuron, dspic, k ee l oq , micro id , mplab, pic, picmicro, picstart, pro mate, powersmart, rfpic, and smartshunt are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. amplab, filterlab, mxdev, mxlab, picmaster, seeval, smartsensor and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. analog-for-the-digital age, app lication maestro, dspicdem, dspicdem.net, dspicworks, ecan, economonitor, fansense, flexrom, fuzzylab, in-circuit serial programming, icsp, icepic, migratable memory, mpasm, mplib, mplink, mpsim, pickit, picdem, picdem.net, piclab, pictail, powercal, powerinfo, powermate, powertool, rflab, rfpicdem, select mode, smart serial, smarttel and total endurance ar e trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of mi crochip technology incorporated in the u.s.a. all other trademarks mentioned herein are property of their respective companies. ? 2004, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. note the following details of the code protection feature on microchip devices: microchip products meet the specification cont ained in their particular microchip data sheet. microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip produc ts in a manner outside the operating specif ications contained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. microchip is willing to work with the customer who is concerned about the integrity of their code. neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are co mmitted to continuously improvin g the code protection features of our products. attempts to break microchip?s code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona and mountain view, california in october 2003. the company?s quality system processes and procedures are for its picmicro ? 8-bit mcus, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified.
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